ISSN 1991-2927
 

ACP № 2 (56) 2019

Determination of Digital Integrated Circuits Thermal Parameters With the Use of Temperature Dependence of Signal Delay Time

Viacheslav Andreevich Sergeev, Ulyanovsk Branch of Kotel’nikov Institute of Radioengineering and Electronics (IRE) of RAS, Doctor of Engineering, Associate Professor; graduated from the Faculty of Physics of Gorky State Technical University; Head of Ulyanovsk Branch of Kotel’nikov Institute of Radioengineering and Electronics (IRE) of RAS; Head of the Department of Radioengineering, Opto and Nanolectronics of Ulyanovsk State Technical University at Ulyanovsk Branch of Kotel’nikov IRE; an author of monographs, inventions, and articles in the field of researching and simulating semiconductor device and integrated circuit performance, and measuring their thermal characteristics. e-mail: This email address is being protected from spambots. You need JavaScript enabled to view it. . [e-mail: This email address is being protected from spambots. You need JavaScript enabled to view it. ]V. Sergeev,

Iaroslav Gennadievich Tetenkin, Ulyanovsk Branch of Kotel’nikov Institute of Radioengineering and Electronics (IRE) of RAS, graduated from the Faculty of Radioengineering of Ulyanovsk State Technical University; Lead Engineer of Ulyanovsk Branch of Kotel’nikov Institute of Radioengineering and Electronics (IRE) of RAS; an author of scientific publications and inventions in the field of computer-aided measurement and parameter analysis of semiconductor device and integrated circuit and measuring their thermal characteristics. [e-mail: This email address is being protected from spambots. You need JavaScript enabled to view it. ]I. Tetenkin

Determination of Digital Integrated Circuits Thermal Parameters With the Use of Temperature Dependence of Signal Delay Time 000_12.pdf

This article examines the well-known methods for measuring thermal parameters of digital integrated circuits (DIC). The opportunity to use DIC signal delay time as a temperature-sensitive parameter (TSP) in the process of measuring DIC thermal parameters is also proposed. It allows to overcome some of the current complexities and disadvantages of the well-known methods of measuring DIC thermal parameters with the use of DIC electrical parameters as TSP and to simplify the measurement process automation. The method of measuring DIC thermal parameters on the basis of measuring the frequency of the ring oscillator that consists of DIC inverters in the process of DIC self-heating with electric power consumed is considered in the article. The estimation of measurement accuracy of CMOS DIC thermal resistance component using the current method is also demonstrated. The automated software-hardware complex for researching CMOS DIC indicial thermal parameters that can significantly improve the accuracy of thermal parameters resolution capability is described.

Digital integrated circuits, thermal parameters, measurement, signal delay time, ring oscillator, oscillator frequency, temperature dependence.

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