ISSN 1991-2927
 

ACP № 2 (56) 2019

Author: "Iurii Aleksandrovich Savostin"

Vitalii Ivanovich Smirnov, Ulyanovsk State Technical University, Doctor of Engineering, Professor; graduated from Gorky State University with the specialty in Physics; Professor of the Department of Design and Technology of Electronic Instrumentation at Ulyanovsk State Technical University; an author of articles, monographs, inventions in the field of measurement instrument automation. [e-mail: smirnov-vi@ulstu.ru]V. Smirnov,

Iurii Aleksandrovich Savostin, JSC “ICC Milandr”, graduated from the Moscow Institute of Electronic Technology with the specialty in Automation and Electronics; Head of Research Laboratory at JSC “ICC Milandr”; an author of publications in the field of measuring semiconductor integrated circuit parameters. [e-mail: savostin.u@ic-design.ru]I. Savostin,

Andrei Anatolievich Gavrikov, Ulyanovsk Branch of the Kotel’nikov Institute of Radio-Engineering and Electronics of the Russian Academy of Sciences, Candidate of Engineering; graduated from Ulyanovsk State Technical University with the specialty in Design and Technology of Electronic Instrumentation; Senior Staff Scientist at the Ulyanovsk Branch of the Kotel’nikov Institute of Radio-Engineering and Electronics of the Russian Academy of Sciences; an author of articles and inventions in the field of measuring thermal and physical parameters of semiconductor devices. [e-mail: a.gavrikoff@gmail.com]A. Gavrikov,

Anton Mikhailovich Shorin, Ulyanovsk State Technical University, from Ulyanovsk State Technical University with the specialty in Design and Technology of Electronic Instrumentation; Postgraduate Student at the Department of Design and Technology of Electronic Instrumentation, an author of publications in the field of measuring thermal and physical parameters of semiconductor devices. [e-mail: anshant@yandex.ru]A. Shorin

Methods and Means for Measuring the Thermal Resistance of Integrated Circuits 51_10.pdf

The article deals with methods and means for measuring the thermal resistance of integrated circuits. The standard measuring methods and a modulation method using heating power varying harmonically are compared. The operation principles of thermal resistance meter based on the modulation method, its software and functionality are described. The results of thermal resistance measurements obtained according to the Industry Standard OST 11 0944-96 (method of constant die temperature) and with the use of modulation method are represented. The results of both methods were demonstrated to go with each other within the standard method accuracy. It is indicated that the ability to measure not only the total resistance ”junction-to-case” but also individual thermal resistance components, e.g. the “junction-chip carrier” components, is a merit of the modulation method. This could be used when testing the quality during mounting the die into the case.

Thermal impedance, integrated circuit, modulation of heating power, thermal resistance components.

2018_ 1

Sections: Electronic and electrical engineering

Subjects: Electrical engineering and electronics.


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